Occupation: Semiconductor Processing Technicians

Semiconductor Processing Technicians

Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.

51-9141.00 | 20 tasks | 8 job titles
Reported Job Titles (8)
  • Device Processing Engineer
  • Diffusion Operator
  • Manufacture Specialist
  • Manufacturing Technician
  • Metalorganic Chemical Vapor Deposition Engineer (MOCVD Engineer)
  • Probe Operator
  • Process Technician
  • Wafer Fabrication Operator
Core Tasks (8)
  • Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.
  • Maintain processing, production, and inspection information and reports.
  • Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.
  • Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.
  • Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.
  • Load and unload equipment chambers and transport finished product to storage or to area for further processing.
  • Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.
  • Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.
Supplemental Tasks (12)
  • Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.
  • Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.
  • Load semiconductor material into furnace.
  • Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.
  • Count, sort, and weigh processed items.
  • Calculate etching time based on thickness of material to be removed from wafers or crystals.
  • Inspect equipment for leaks, diagnose malfunctions, and request repairs.
  • Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.
  • Stamp, etch, or scribe identifying information on finished component according to specifications.
  • Scribe or separate wafers into dice.
  • Connect reactor to computer, using hand tools and power tools.
  • Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.